DocumentCode
2355814
Title
Experimental validation of crosstalk simulations for on-chip interconnects at high frequencies using S-parameters
Author
Kobrinsky, Mauro J. ; Chakravarty, Sourav ; Jiao, Dan ; Harmes, Michael ; List, S. ; Mazumde, Mohiuddin
Author_Institution
Components Res., Intel Corp., Hillsboro, OR, USA
fYear
2003
fDate
27-29 Oct. 2003
Firstpage
329
Lastpage
332
Abstract
Since advanced microprocessors are designed based on simulation tools, accurate assessments of the amount of crosstalk noise are of paramount importance to avoid logic failures and less-than-optimal designs. With increasing clock frequencies, inductive effects become more important, and the validity of assumptions commonly used in simulation tools and approaches is unclear. We compared accurate experimental S-parameters with results derived from both magneto-quasi-static and fullwave simulation tools, for simple crosstalk structures with various capacitive and inductive couplings, in the presence of parallel and orthogonal conductors. Our validation approach made possible the identification of the strengths and weaknesses of both tools as a function of frequency, which provides useful guidance to designers who have to balance the trade-offs between accuracy and computation expenses for a large variety of cases.
Keywords
S-parameters; circuit simulation; computational electromagnetics; coupled circuits; crosstalk; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; integrated circuit noise; S-parameters; capacitive coupling; crosstalk noise; crosstalk simulation; crosstalk structures; full-wave simulation tools; high-frequency on-chip interconnects; inductive coupling; inductive effects; magneto-quasi-static simulation tools; microprocessor design; orthogonal conductors; parallel conductors; signal integrity; Concurrent computing; Conductors; Crosstalk; Electrical resistance measurement; Frequency measurement; Logic; Noise measurement; Scattering parameters; Signal processing; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2003
Conference_Location
Princeton, NJ, USA
Print_ISBN
0-7803-8128-9
Type
conf
DOI
10.1109/EPEP.2003.1250061
Filename
1250061
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