Title :
Development and pulse evaluation of silicon carbide SGTO modules
Author :
Brien, Heather O. ; Ogunniyi, Aderinto ; Ovrebo, Gregory K. ; Scozzie, Charles J. ; Shaheen, William ; Zhang, Qingchun ; Agarwal, Anant ; Temple, Victor
Author_Institution :
Res. Lab., U.S. Army, Adelphi, MD, USA
Abstract :
Silicon carbide Super-GTOs are being pursued by the Army as a replacement for current silicon-based high-power pulse switches. The devices discussed in this paper were designed and fabricated by Silicon Power and Cree and evaluated at the Army Research Laboratory. The chips were packaged in groups of four to create the first modules of silicon carbide Super-GTOs. Each switch module contains four parallel 7.76 mm × 7.76 mm silicon carbide Super-GTOs for 2.4 cm2 total device area. The modules were switched at a 1-ms wide half-sine shaped current pulse to assess peak pulse current capability, on-state voltage drop, and current sharing between parallel switches. Peak module current was 3.7 kA (I2t of 7000 A2s) with a voltage drop of 10 V. A thermal simulation of the module was developed in SolidWorks and COSMOSWorks, with temperature saturation approaching 193 °C after 20 pulses at 5% duty cycle.
Keywords :
electric potential; power semiconductor switches; pulsed power switches; semiconductor device packaging; silicon compounds; wide band gap semiconductors; SGTO modules; current 3.7 kA; high-power pulse switches; on-state voltage drop; parallel switches; peak module current; peak pulse current; silicon carbide; sine shaped current pulse; size 7.76 mm; thermal simulation; time 1 ms; voltage 10 V; Anodes; Current measurement; Logic gates; Silicon; Silicon carbide; Switches; Voltage measurement; power semiconductor switches; pulse power system switches; semiconductor device measurements; semiconductor device packaging;
Conference_Titel :
Power Modulator and High Voltage Conference (IPMHVC), 2010 IEEE International
Conference_Location :
Atlanta, GA
Print_ISBN :
978-1-4244-7131-7
DOI :
10.1109/IPMHVC.2010.5958323