• DocumentCode
    2355887
  • Title

    Development and pulse evaluation of silicon carbide SGTO modules

  • Author

    Brien, Heather O. ; Ogunniyi, Aderinto ; Ovrebo, Gregory K. ; Scozzie, Charles J. ; Shaheen, William ; Zhang, Qingchun ; Agarwal, Anant ; Temple, Victor

  • Author_Institution
    Res. Lab., U.S. Army, Adelphi, MD, USA
  • fYear
    2010
  • fDate
    23-27 May 2010
  • Firstpage
    178
  • Lastpage
    181
  • Abstract
    Silicon carbide Super-GTOs are being pursued by the Army as a replacement for current silicon-based high-power pulse switches. The devices discussed in this paper were designed and fabricated by Silicon Power and Cree and evaluated at the Army Research Laboratory. The chips were packaged in groups of four to create the first modules of silicon carbide Super-GTOs. Each switch module contains four parallel 7.76 mm × 7.76 mm silicon carbide Super-GTOs for 2.4 cm2 total device area. The modules were switched at a 1-ms wide half-sine shaped current pulse to assess peak pulse current capability, on-state voltage drop, and current sharing between parallel switches. Peak module current was 3.7 kA (I2t of 7000 A2s) with a voltage drop of 10 V. A thermal simulation of the module was developed in SolidWorks and COSMOSWorks, with temperature saturation approaching 193 °C after 20 pulses at 5% duty cycle.
  • Keywords
    electric potential; power semiconductor switches; pulsed power switches; semiconductor device packaging; silicon compounds; wide band gap semiconductors; SGTO modules; current 3.7 kA; high-power pulse switches; on-state voltage drop; parallel switches; peak module current; peak pulse current; silicon carbide; sine shaped current pulse; size 7.76 mm; thermal simulation; time 1 ms; voltage 10 V; Anodes; Current measurement; Logic gates; Silicon; Silicon carbide; Switches; Voltage measurement; power semiconductor switches; pulse power system switches; semiconductor device measurements; semiconductor device packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator and High Voltage Conference (IPMHVC), 2010 IEEE International
  • Conference_Location
    Atlanta, GA
  • Print_ISBN
    978-1-4244-7131-7
  • Type

    conf

  • DOI
    10.1109/IPMHVC.2010.5958323
  • Filename
    5958323