DocumentCode :
2355928
Title :
P2O-6 Design of GaAs Resonant Micro-Beams
Author :
Leblois, T.G. ; Tellier, C.R.
Author_Institution :
Dept. D.C.E.P., Inst. FEMTO-ST, Besancon
fYear :
2006
fDate :
2-6 Oct. 2006
Firstpage :
1918
Lastpage :
1921
Abstract :
This paper reports on GaAs resonant microbeams for mass sensing applications. We present a resonant GaAs sensor driven by a lateral field excitation and given a frequency dependent voltage as output. Thanks to an analytical model of piezoelectric excitation, we determine potentially interesting geometries of beams for quasi extensional or quasi shear modes on a (110) wafer. The piezoresistive detection of time dependent stress can be achieved by use of p-GaAs gauges connected in a bridge circuit. The simulator TENSOSIM which is elaborated to furnish etching shapes for 2D or 3D micromechanical structures is used to derive at any etching time the cross sectional shape of GaAs beams micromachined in a H2SO4:H2O2:H2O solution. Influence of misalignment on the performances of the micromachined sensor is evaluated and reveals small departures
Keywords :
beams (structures); crystal resonators; gallium arsenide; micromechanical resonators; piezoelectricity; sensors; ultrasonic transducers; GaAs; TENSOSIM simulator; bridge circuit; frequency dependent voltage; gallium arsenide resonant microbeam design; lateral field excitation; mass sensing applications; micromachined sensor; micromachining; p-GaAs gauges; piezoelectric excitation analytical model; piezoresistive stress detection; quasi-extensional modes; quasi-shear modes; resonant GaAs sensor; sulfuric acid-peroxide-water solution; Analytical models; Etching; Frequency dependence; Gallium arsenide; Geometry; Piezoresistance; Resonance; Shape; Stress; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
ISSN :
1051-0117
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
Type :
conf
DOI :
10.1109/ULTSYM.2006.482
Filename :
4152338
Link To Document :
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