New materials and novel applications for CMP

CMP is well established as the best known process for planarization and smoothing of many materials used in electronic device manufacturing. In recent years, additional materials and new applications have evolved that leverage the unique capabilities of CMP. However, many of these applications also involve significant technical challenges for process and integration teams. This paper discusses some of the techniques used to achieve required CMP results. Several examples of the proposed approach will also be shared which include planarization of a polymer layer and final polish of a SiGe surface after direct wafer bond and splitting (similar to silicon-on-insulator substrates).