DocumentCode
2356090
Title
Comparison of film capacitor designs for a high power density application
Author
Ennis, J.B. ; Rauch, J. ; Yang, X.H. ; Atkins, J.
Author_Institution
Gen. Atomics Electron. Syst., Inc., San Diego, CA, USA
fYear
2010
fDate
23-27 May 2010
Firstpage
225
Lastpage
228
Abstract
Three designs for an 8μF 3.1kV snubber capacitor were built and tested to compare the performance of different technologies for a high RMS current requirement. The designs were (1) extended foil , (2) metalized film, and (3) a hybrid containing both a metalized electrode and extended foil electrodes. All were impregnated with a vegetable oil and epoxy encapsulated in the same size case. The prototype of the hybrid design was only a 6μF capacitor due to machine limitations on winding dimensions that have since been resolved. A short-term, stepped-voltage test was performed on samples of each design until the units failed or to a maximum of 8.0kV, more than 2.5 times the rated voltage. Short-circuit discharge, AC partial discharge measurements, and AC stepped-stress tests were also performed and will be reported. The implications of these test data for the selection of specific capacitor technologies for power electronics applications will be discussed.
Keywords
electrodes; partial discharge measurement; power capacitors; power electronics; snubbers; vegetable oils; AC partial discharge measurements; AC stepped-stress tests; capacitance 6 muF; capacitance 8 muF; extended foil electrodes; film capacitor designs; high power density application; metalized electrode; metalized film; power electronics applications; short-circuit discharge; snubber capacitor; stepped-voltage test; vegetable oil; voltage 3.1 kV; voltage 8.0 kV; Capacitance; Capacitors; Current measurement; Films; Temperature measurement; Voltage measurement; Windings; RMS current; capacitor; extended foil; metalized film; self-healing;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Modulator and High Voltage Conference (IPMHVC), 2010 IEEE International
Conference_Location
Atlanta, GA
Print_ISBN
978-1-4244-7131-7
Type
conf
DOI
10.1109/IPMHVC.2010.5958334
Filename
5958334
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