• DocumentCode
    2356182
  • Title

    P2P-7 Design, Fabrication and Characterisation of High Frequency Piezoelectric Micromachined Ultrasonic Transducers

  • Author

    Duval, F. ; Hladky-Hennion, A.-C. ; Cattan, E. ; Zhang, Q. ; Dorey, R.

  • Author_Institution
    Inst. d´´Electronique, de Microelectronique et de Nanotechnologie, Univ. de Lille
  • fYear
    2006
  • fDate
    2-6 Oct. 2006
  • Firstpage
    1959
  • Lastpage
    1962
  • Abstract
    High frequency bending mode membranes are fabricated using a 1 mum PZT thick film deposited by sol-gel. Finite element analysis (FEA) is used to tailor the membrane radius to a resonant frequency in the 5-10 MHz frequency range. Using a radius of 16 and 24 mum, devices are produced as individual cells as well as 3 times 3 and 5 times 5 arrays. The arrays are designed so that the bottom electrode is common to all cells whereas the top electrode is only common to a column of 5 or 3 cells depending on the type of arrays. Within a column each cell was separated by a wall of silicon (having the length of the substrate of silicon) in order to sustain the array, reduce parasitic vibrations, hence cross-talk. A 16 mum radius membrane shows a resonant frequency of 9 MHz and a coupling coefficient of 11%. Suspended cells are also investigated to increase frequency further. Two arms-suspended cells resonate at 8.1 MHz for a 24 mum radius membrane
  • Keywords
    finite element analysis; lead compounds; membranes; micromechanical devices; piezoelectric transducers; sol-gel processing; thick film devices; titanium compounds; ultrasonic transducer arrays; zirconium compounds; 1 micron; 16 micron; 24 micron; 5 to 10 MHz; PZT; PZT thick film; PbZrO3TiO3; bending mode membranes; finite element analysis; piezoelectric micromachined ultrasonic transducers; sol-gel deposition; Biomembranes; Electrodes; Fabrication; Field emitter arrays; Finite element methods; Resonant frequency; Silicon; Substrates; Thick films; Ultrasonic transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2006. IEEE
  • Conference_Location
    Vancouver, BC
  • ISSN
    1051-0117
  • Print_ISBN
    1-4244-0201-8
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2006.495
  • Filename
    4152351