Study on a novel CMP/P-CVM fusion processing system (Type B) and its basic characteristics

In this study, we are aiming to establish a high-efficiency, high-quality polishing process of the hard-to-process materials. Recently high-grade semiconductor substrates are made by various processing methods. CMP (Chemical Mechanical Polishing) is a main processing method to planarize a substrate. On the other hand, P-CVM is a superior processing method which does not damage the substrate surface. To achieve high-efficiency, high-quality processing, we designed an innovative fusion CMP/P-CVM processing machine and produced it experimentally. Through investigation of a fundamental property of the CMP/P-CVM fusion processing machine, we confirmed increase in removal rate and reduction of the surface roughness by the synergistic effects.