DocumentCode :
235626
Title :
Study on controlling mechanism of step-terrace structure in CeO2 slurry polishing of 4H-SiC
Author :
Hui Deng ; Endo, Kazuhiro ; Yamamura, Kazuya
Author_Institution :
Res. Center for Ultra-precision Sci. & Technol., Osaka Univ., Suita, Japan
fYear :
2014
fDate :
19-21 Nov. 2014
Firstpage :
147
Lastpage :
148
Abstract :
4H-SiC is considered one of the most promising next-generation semiconductor materials. Therefore, flattening methods of 4H-SiC and their mechanism have been widely studied in recent years. Although the generation of different types of step-terrace structure of 4H-SiC has been widely reported, their generation mechanism has not been thoroughly clarified. In this manuscript, the change of the surface atomic structure (step-terrace) structure of single-crystal silicon carbide (4H-SiC) along with the increasing of the pad rotation speed was confirmed. The generation mechanism of different types of step-terrace structure of 4H-SiC was proposed and experimentally clarified. We proved that the generation of different types of step-terrace structure of 4H-SiC could be controlled by adjusting the balance between chemical modification and physical removal in polishing.
Keywords :
cerium compounds; chemical mechanical polishing; silicon compounds; slurries; wide band gap semiconductors; CeO2; SiC; chemical modification; flattening methods; generation mechanism; next-generation semiconductor materials; pad rotation speed; physical removal; single-crystal silicon carbide; slurry polishing; step-terrace structure; surface atomic structure; Chemicals; Oxidation; Periodic structures; Silicon carbide; Slurries; Substrates; Surface treatment;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
Type :
conf
DOI :
10.1109/ICPT.2014.7017267
Filename :
7017267
Link To Document :
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