Title :
Modelling the self-heating of power devices
Author :
Kraus, R. ; Türkes, P. ; Mattausch, H.J.
Author_Institution :
University of Bundeswehr Munich
Keywords :
Circuit simulation; Diodes; Electronic packaging thermal management; MOSFET circuits; Power MOSFET; Power dissipation; Power measurement; Temperature dependence; Thermal resistance; Threshold voltage;
Conference_Titel :
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
DOI :
10.1109/ISPSD.1992.991248
