DocumentCode :
2356266
Title :
P2P-10 Electrostatic-Mechanical Direct Coupling and FEM-BEM Coupling for CMUT Electroacoustic Parameters Identification
Author :
Ekeom, D.
Author_Institution :
Inst. d ´´Electronique de Microelectronique et de Nanotechnologie, Departement ISEN, Lille
fYear :
2006
fDate :
2-6 Oct. 2006
Firstpage :
1971
Lastpage :
1974
Abstract :
Capacitive micromachined ultrasonic transducer (CMUT) arrays are seen as a promising way to improve ultrasound-imaging definition and they may supplant piezocomposite arrays for such applications. However, as a new technology it needs to be evaluated and modelling can help to design devices using cMUT technology. Implicit finite element codes are commonly used to model cMUT devices, but to take into account the fluid surrounding the device $radiation, scattering and the inter-mutual acoustic influence of the CMUT arrays cells - the boundary element method (BEM) coupled with the finite element method (FEM) can be advantageously used. Moreover the standard electromechanical coupling is either weak or lumped and cannot be used to model CMUT accurately. A FEM-BEM coupling together with an electro-mechanical direct coupling as add-on modules for ANSYSreg were developed. This paper will show how to identify exact nonlinear equivalent circuit lumped parameters from a FEM and FEM-BEM simulation. The electrical and motional branch of the circuit is identified by resonance and antiresonance modal analysis. The radiating impedance is computed using a FEM-BEM coupling in frequency domain. Finally the transducer insertion loss is evaluate
Keywords :
acoustoelectric effects; acoustoelectric transducers; boundary-elements methods; electromechanical effects; finite element analysis; micromechanical devices; ultrasonic transducer arrays; ANSYS; CMUT arrays; CMUT electroacoustic parameters; FEM-BEM coupling; antiresonance modal analysis; boundary element method; capacitive micromachined ultrasonic transducer arrays; electromechanical coupling; electrostatic-mechanical direct coupling; equivalent circuit; finite element codes; finite element method; radiating impedance; transducer insertion loss; ultrasound-imaging definition; Acoustic arrays; Acoustic devices; Acoustic scattering; Boundary element methods; Coupling circuits; Finite element methods; Parameter estimation; Ultrasonic imaging; Ultrasonic transducer arrays; Ultrasonic transducers;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Ultrasonics Symposium, 2006. IEEE
Conference_Location :
Vancouver, BC
ISSN :
1051-0117
Print_ISBN :
1-4244-0201-8
Electronic_ISBN :
1051-0117
Type :
conf
DOI :
10.1109/ULTSYM.2006.498
Filename :
4152354
Link To Document :
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