Microreplicated pad conditioner for copper and copper barrier CMP applications

Metal-free micro-replicated conditioning disks are applied to the development of Cu and Cu barrier CMP processes for 22nm technology nodes. Compared with traditional pad conditioners with diamond grits embedded in metal matrix, the micro-replicated conditioners demonstrate lower within-wafer non-uniformity, more stable end-point time, more uniform and controllable pad wear, lower defectivity, and longer pad life time. Used pad analyses provide insights into the effectiveness of conditioning and guidelines for further process improvement.