DocumentCode :
235639
Title :
A low-cost PCB fabrication process
Author :
Ou, Jinping ; Maldonado, Andres ; Chio Saephan ; Farahmand, Farid ; Caggiano, Michael
Author_Institution :
Eng. Sci., Sonoma State Univ., Rohnert Park, CA, USA
fYear :
2014
fDate :
27-30 May 2014
Firstpage :
2159
Lastpage :
2162
Abstract :
This paper investigates the resolution of a low-cost printed circuit board (PCB) fabrication process. A set of frequently used footprints is fabricated on a PCB and examined under a digital microscope. The results indicate that using the process described in this paper, a thin wire with a 0.38 mm (14.96 mils) width can be fabricated. The process described in this paper is useful for educators who wish to fabricate a fine structure on a PCB, but do not have access to a milling machine. It is also be useful for researchers who wish to quickly build an inexpensive prototype before sending out the final design to a commercial venue.
Keywords :
printed circuit manufacture; printed circuits; digital microscope; footprint; low-cost PCB fabrication process; milling machine; printed circuit board; size 0.38 mm; thin wire; Band-pass filters; Copper; Fabrication; Films; Geometry; Layout; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
Conference_Location :
Orlando, FL
Type :
conf
DOI :
10.1109/ECTC.2014.6897601
Filename :
6897601
Link To Document :
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