Title :
Soft CMP pads for low defectivity in CMP processes
Author :
Fengji Yeh ; Yeh, Anson ; DeGroot, Marty W. ; Qian, Bainian ; Reddy, Arun ; Buley, Todd
Author_Institution :
Rohm & Haas Electron. Mater. Asia Pacific Co. Ltd., Jhunan, Taiwan
Abstract :
New approaches to soft polyurethane materials have been developed with the characteristics of high texturability and tunability in physical properties. The approach has resulted in low defectivity and high performance stability in a range of sensitive CMP applications, including copper barrier applications.
Keywords :
chemical mechanical polishing; CMP processes; copper barrier applications; low defectivity; soft CMP pads; soft polyurethane materials; Companies; Copper; Planarization; Slurries; Surface texture;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017273
