DocumentCode
2356719
Title
Low-temperature SOI wafer bonding
Author
Sugimoto, F. ; Arimoto, Y.
Author_Institution
Fujitsu Laboratories Ltd.
fYear
1992
fDate
1992
Firstpage
240
Lastpage
241
Keywords
Adhesives; Annealing; Electron devices; Heating; Laboratories; Measurement techniques; Silicon on insulator technology; Temperature; Testing; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
Type
conf
DOI
10.1109/ISPSD.1992.991275
Filename
991275
Link To Document