Title :
Low-temperature SOI wafer bonding
Author :
Sugimoto, F. ; Arimoto, Y.
Author_Institution :
Fujitsu Laboratories Ltd.
Keywords :
Adhesives; Annealing; Electron devices; Heating; Laboratories; Measurement techniques; Silicon on insulator technology; Temperature; Testing; Wafer bonding;
Conference_Titel :
Power Semiconductor Devices and ICs, 1992. ISPSD '92. Proceedings of the 4th International Symposium on
DOI :
10.1109/ISPSD.1992.991275
