• DocumentCode
    235680
  • Title

    Effects of alignment of graphene flakes on water permeability of graphene-epoxy composite film

  • Author

    Seong-Yoon Jung ; Kyung-Wook Paik

  • Author_Institution
    Dept. of Mater. & Sci. Eng., Korea Adv. Inst. of Sci. & Technol. (KAIST), Daejeon, South Korea
  • fYear
    2014
  • fDate
    27-30 May 2014
  • Firstpage
    2255
  • Lastpage
    2259
  • Abstract
    In this study, the electric field-assisted alignment of graphene flakes in B-stage graphene-epoxy composite film was demonstrated. Compared with conventional electric field-induced alignment method which involves curing liquid phase polymer matrix, the electric field application on B-stage composite film with controlled viscosity can achieve graphene flake alignment without any curing reactions, thereby enabling further processes such as film application, assembly and curing. B-stage graphene-epoxy composite was prepared by solution-mixing method, and electric field was applied parallel to the film with various temperature and electric field strengths. Cross-sectional SEM images revealed that graphene flakes were horizontally aligned better as film viscosity decreased and electric field strength increased. However, curing reaction at high temperature should be considered because high temperature was needed to achieve low viscosity. The aligned graphene-epoxy composite film showed lower water vapor transmission rate (WVTR).
  • Keywords
    curing; electric field effects; filled polymers; graphene; liquid phase deposition; permeability; polymer films; scanning electron microscopy; C; cross sectional SEM images; curing reactions; electric field assisted alignment; graphene flakes alignment; graphene-epoxy composite film; liquid phase polymer matrix; solution mixing method; water permeability; water vapor transmission rate; Curing; Electric fields; Films; Graphene; Polymers; Temperature measurement; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th
  • Conference_Location
    Orlando, FL
  • Type

    conf

  • DOI
    10.1109/ECTC.2014.6897618
  • Filename
    6897618