• DocumentCode
    2356814
  • Title

    Stiffness modeling across transition temperatures in virtual environments by B-spline interpolation

  • Author

    Mitsantisuk, Chowarit ; Ohishi, Kiyoshi ; Urushihara, Shiro ; Katsura, Seiichiro

  • Author_Institution
    Dept. of Electr. Eng., Nagaoka Univ. of Technol., Nagaoka, Japan
  • fYear
    2010
  • fDate
    21-24 March 2010
  • Firstpage
    349
  • Lastpage
    354
  • Abstract
    The development of haptic technology has been a significant trend worldwide. To simulate the virtual environments, several researchers have estimated the parameters of environment in order to interact with human operators. However, the material properties of real environments are greatly influenced by temperature. In this paper, the haptic data-based is designed and all of the properties of B-spline curves can be adopted to construct the virtual environments. The order of the curve for the B-spline blending function is set as the natural cubic B-spline. Thus, it is possible to generate a good realization of interaction force and simulate a soft and hard virtual environment according to the material properties. From the experimental results, the proposed mathematical model can be changed the material properties under various condition of temperature.
  • Keywords
    curve fitting; haptic interfaces; human-robot interaction; interpolation; splines (mathematics); temperature control; virtual reality; B-spline blending function; B-spline curves; B-spline interpolation; haptic technology; stiffness modeling; transition temperatures; virtual environments; Databases; Haptic interfaces; Human robot interaction; Interpolation; Material properties; Medical robotics; Service robots; Spline; Temperature distribution; Virtual environment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Motion Control, 2010 11th IEEE International Workshop on
  • Conference_Location
    Nagaoka, Niigata
  • ISSN
    1943-6572
  • Print_ISBN
    978-1-4244-6668-9
  • Electronic_ISBN
    1943-6572
  • Type

    conf

  • DOI
    10.1109/AMC.2010.5464108
  • Filename
    5464108