Title :
Effects of pump-induced particle agglomeration during chemical mechanical planarization (CMP)
Author :
Young-Gil Seo ; Elaiyaraju, Periyasamy ; Jin-Goo Park
Author_Institution :
Dept. of Mater. Eng., Hanyang Univ., Ansan, South Korea
Abstract :
In this study, the effects of large particle in chemical mechanical planarization (CMP) slurry were investigated on slurry distribution system, which utilizes a pumping device to circulate CMP slurry. Three different types of pumps (e.g., bellows, diaphragm and magnetically levitated centrifugal pump) were evaluated their performance such as generation of agglomerated particle and defectivity in different of slurries (Ceria slurry, Silica slurry a, Silica slurry b).
Keywords :
bellows; cerium compounds; chemical mechanical polishing; diaphragms; planarisation; pumps; silicon compounds; slurries; CMP slurry; CeO2; SiO2; centrifugal pump; ceria slurry; chemical mechanical planarization; pump-induced particle agglomeration; pumping device; silica slurry a; silica slurry b; slurry distribution system; Atmospheric measurements; Bellows; Particle measurements; Planarization; Silicon compounds; Slurries; Stress;
Conference_Titel :
Planarization/CMP Technology (ICPT), 2014 International Conference on
Conference_Location :
Kobe
Print_ISBN :
978-1-4799-5556-5
DOI :
10.1109/ICPT.2014.7017293
