• DocumentCode
    235699
  • Title

    Cu corrosion in laminar flow using microfluidic channels

  • Author

    Abe, Makoto ; Takato, Chikako ; Hamada, Satomi ; Hayase, Masanori

  • Author_Institution
    Ebara Corp., Fujisawa, Japan
  • fYear
    2014
  • fDate
    19-21 Nov. 2014
  • Firstpage
    265
  • Lastpage
    268
  • Abstract
    Increases in the sizes of silicon wafers and the degree of circuit integration has led to a requirement for a reduction in the size and number of defects, including defects caused by corrosion during the Cu-chemical mechanical polishing (CMP) or cleaning processes.
  • Keywords
    chemical analysis; copper; corrosion; laminar flow; microfluidics; silicon; CMP; Cu; chemical mechanical polishing; circuit integration; cleaning processes; corrosion; defects; laminar flow; microfluidic channels; wafer sizes; Copper; Corrosion; Grain boundaries; Microfluidics; Planarization; Rough surfaces; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Planarization/CMP Technology (ICPT), 2014 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    978-1-4799-5556-5
  • Type

    conf

  • DOI
    10.1109/ICPT.2014.7017295
  • Filename
    7017295
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235699