Title :
IEEE/SEMI 1998 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop (Cat. No.98CH36168)
Abstract :
The following topics were dealt with: yield modeling and analysis; overall equipment efficiency; yield enhancement strategies and techniques; harnessing and developing workforce potential; contamination free manufacturing; advanced metrology; cost reduction; photolithography and etching; interconnect technology; factory automation and WIP management; isolation and dielectric issues at 0.18 μm; factory modeling and simulation.
Keywords :
dielectric thin films; etching; factory automation; integrated circuit economics; integrated circuit interconnections; integrated circuit manufacture; integrated circuit measurement; integrated circuit modelling; integrated circuit yield; isolation technology; personnel; photolithography; production engineering computing; surface contamination; WIP management; contamination free manufacturing; cost reduction; dielectric issues; equipment efficiency; etching; factory automation; factory modeling; factory simulation; interconnect technology; isolation; metrology; photolithography; semiconductor manufacturing; workforce potential; yield analysis; yield enhancement strategies; yield modeling;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location :
Boston, MA, USA
Print_ISBN :
0-7803-4380-8
DOI :
10.1109/ASMC.1998.731353
