Title :
Eighteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. Proceedings 2002 (Cat.No.02CH37311)
Abstract :
The following topics are dealt with: advances in compact models; package and material characterization; device and component characterization and modeling; system level analysis; liquid cooling applications.
Keywords :
cooling; integrated circuit measurement; integrated circuit modelling; multichip modules; semiconductor device models; thermal management (packaging); thermal variables measurement; compact models; component characterization; component modeling; device characterization; device modeling; liquid cooling applications; material characterization; package characterization; semiconductor thermal management; semiconductor thermal measurement; system level analysis;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7327-8
DOI :
10.1109/STHERM.2002.991337
