Title :
Thermal standards for the 21/sup st/ century
Author :
Guenin, Bruce M.
Author_Institution :
RAS Comput. Anal. Lab., Sun Microsystems, San Diego, CA, USA
Abstract :
The existence of effective standards is critical to the success of the electronics industry. The rapid pace of technical change necessitates the continual evolution of these standards. The JEDEC JC15.1 Thermal Subcommittee has played a crucial role by standardizing thermal test techniques. It is facing additional challenges in this new century to provide standards to facilitate the development and application of sophisticated computer simulation methodologies needed to support the shortened cycle times for product development required by today´s market.
Keywords :
electronics industry; product development; standards; thermal management (packaging); JEDEC JC15.1 Thermal Subcommittee; computer simulation methodologies; cycle times; electronics industry; product development; technical change; thermal standards; thermal test techniques; Circuit testing; Copper alloys; Electronic packaging thermal management; Heat sinks; Standards development; Surface resistance; Surface-mount technology; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7327-8
DOI :
10.1109/STHERM.2002.991338
