Thermal standards for the 21/sup st/ century

Author

Guenin, Bruce M.

Author_Institution

RAS Comput. Anal. Lab., Sun Microsystems, San Diego, CA, USA

fYear

2002

fDate

12-14 March 2002

Firstpage

1

Lastpage

7

Abstract

The existence of effective standards is critical to the success of the electronics industry. The rapid pace of technical change necessitates the continual evolution of these standards. The JEDEC JC15.1 Thermal Subcommittee has played a crucial role by standardizing thermal test techniques. It is facing additional challenges in this new century to provide standards to facilitate the development and application of sophisticated computer simulation methodologies needed to support the shortened cycle times for product development required by today´s market.

Keywords

electronics industry; product development; standards; thermal management (packaging); JEDEC JC15.1 Thermal Subcommittee; computer simulation methodologies; cycle times; electronics industry; product development; technical change; thermal standards; thermal test techniques; Circuit testing; Copper alloys; Electronic packaging thermal management; Heat sinks; Standards development; Surface resistance; Surface-mount technology; Temperature; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium

Conference_Location

San Jose, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-7327-8

Type

conf

DOI

10.1109/STHERM.2002.991338

Filename

991338