DocumentCode
2357522
Title
Thermal compact models for electronic systems
Author
Bosch, E.G.T. ; Sabry, M.N.
Author_Institution
Philips Res., Eindhoven, Netherlands
fYear
2002
fDate
12-14 March 2002
Firstpage
21
Lastpage
29
Abstract
Compact thermal models have been constructed for different levels in electronic systems with a variable degree of success. Many of these models suffer from the need to make ad-hoc assumptions about the number of nodes to be used in the model and require a predefined set of boundary conditions that are used to generate the compact model. In this work first steps towards a method that is firmly based on physical understanding and mathematical rigor are presented for linear compact models. The method gives general constraints on the form of compact models that will ensure an adequate description of thermal systems. Furthermore, the method allows reduction of the generating set of boundary conditions to an absolute minimum while at the same time providing information about the errors that are inevitable in the predictions of a compact model. Using these error estimates it is possible to determine the optimal number of nodes to be used in the compact model for a desired accuracy. The method will be applied to the benchmark defined for this purpose.
Keywords
error analysis; packaging; thermal analysis; benchmark; boundary conditions; electronic systems; error estimates; linear models; nodes; package; thermal compact models; thermal systems; Boundary conditions; Electronic packaging thermal management; Fluid dynamics; Graphics; Heat transfer; Integrated circuit modeling; Mathematical model; Modems; Predictive models; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location
San Jose, CA, USA
ISSN
1065-2221
Print_ISBN
0-7803-7327-8
Type
conf
DOI
10.1109/STHERM.2002.991341
Filename
991341
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