• DocumentCode
    2357602
  • Title

    Strain balance approach for optimized signal-to-noise ratio in SiGe quantum well bolometers

  • Author

    Di Benedetto, L. ; Kolahdouz, M. ; Malm, B.G. ; Ostling, M. ; Radamson, H.H.

  • Author_Institution
    Sch. of Inf. & Commun. Technol., KTH (R. Inst. of Technol.), Kista, Sweden
  • fYear
    2009
  • fDate
    14-18 Sept. 2009
  • Firstpage
    101
  • Lastpage
    104
  • Abstract
    This work presents thermal and electrical characterization of SiGe/Si multi-quantum wells (MQWs) with different layer profiles in complete bolometer structures. The thermal property of the bolometers was studied by measuring thermal coefficient of resistivity (TCR) through I-V curves for five temperatures (25, 40, 55, 80 and 100degC) and for four different pixel areas. The results show a strong dependency of TCR on the Si/SiGe layer thickness and the presence of dopant impurity in the MQW. The noise measurements of MQWs were performed carefully by eliminating all external contributions and the noise spectroscopy provided the noise characteristic parameters. The results demonstrate that the noise depends on the geometric size of the MQW and it increases with decreasing of the pixel area. The investigations show the noise level in the bolometer structures is sensitive to any dopant segregation from the contact layers.
  • Keywords
    Ge-Si alloys; bolometers; doping profiles; electrical conductivity measurement; elemental semiconductors; semiconductor device noise; semiconductor doping; semiconductor materials; semiconductor quantum wells; silicon; thermal conductivity measurement; I-V curves; MQW geometric size; Si-SiGe; bolometer structures; contact layers; dopant impurity; dopant segregation; electrical characterization; noise level; noise measurements; noise spectroscopy; optimized signal-to-noise ratio; pixel areas; quantum well bolometers; strain balance approach; temperature 100 degC; temperature 25 degC; temperature 40 degC; temperature 55 degC; temperature 80 degC; thermal characterization; thermal resistivity coefficient measurement; Area measurement; Bolometers; Capacitive sensors; Conductivity; Germanium silicon alloys; Quantum well devices; Signal to noise ratio; Silicon germanium; Temperature; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European
  • Conference_Location
    Athens
  • ISSN
    1930-8876
  • Print_ISBN
    978-1-4244-4351-2
  • Electronic_ISBN
    1930-8876
  • Type

    conf

  • DOI
    10.1109/ESSDERC.2009.5331312
  • Filename
    5331312