Title :
The thermal management of a seven-die multichip module
Author :
Feng, Andy ; Hsieh, Alex
Author_Institution :
Semicond. Group, Orient Semicond. Electron. Ltd., Kaohsiung, Taiwan
Abstract :
The thermal management of a multichip module (MCM) is not an easy task due to the much harsher thermal requirements especially where a 7-die MCM is concerned. The thermal management for this module has been investigated. This paper describes how to manage the thermal requirements of MCM for various package types such as flip chip and stacked-die solutions.
Keywords :
forced convection; multichip modules; thermal management (packaging); thermal resistance; flip chip; package types; seven-die multichip module; stacked-die solutions; thermal management; thermal requirements; Computational fluid dynamics; Computational modeling; Electromagnetic compatibility; Electronic packaging thermal management; Flip chip; Heat sinks; Multichip modules; Thermal management; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
Print_ISBN :
0-7803-7327-8
DOI :
10.1109/STHERM.2002.991346
