Numerical simulation of phase change heat transfer in PCM-encapsulated heat sinks

Author

Liu, Beimen ; Majumdar, Pradip

Author_Institution

Dept. of Mech. Eng., Northern Illinois Univ., DeKalb, IL, USA

fYear

2002

fDate

12-14 March 2002

Firstpage

88

Lastpage

91

Abstract

The enthalpy-based computational model is developed for analysing PCM-encapsulated heat sinks for electronics chips. Solution is obtained by developing a control volume-based finite difference code and results are validated by comparing results with that given by analytical solution available for a limiting case problem. Preliminary results based on a parametric study indicate the two-dimensional code developed for this study can be used in evaluating PCM, and selecting geometrical dimensions of the PCM encapsulated heat sink.

Keywords

circuit simulation; cooling; enthalpy; finite difference methods; heat sinks; integrated circuit modelling; integrated circuit packaging; solid-liquid transformations; thermal analysis; thermal management (packaging); 2D finite difference code; PCM-encapsulated heat sinks; control volume-based finite difference method; electronic chips; enthalpy-based computational model; geometrical dimensions; latent heat transfer; limiting case problem; numerical simulation; parametric study; phase change heat transfer; phase change materials; Conducting materials; Electronics cooling; Finite difference methods; Heat sinks; Heat transfer; Numerical simulation; Phase change materials; Solids; Temperature; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium

Conference_Location

San Jose, CA, USA

ISSN

1065-2221

Print_ISBN

0-7803-7327-8

Type

conf

DOI

10.1109/STHERM.2002.991351

Filename

991351