• DocumentCode
    235788
  • Title

    Case study of embedded memory failure analysis for dislocation issue

  • Author

    Cheng Wei Tang ; Shin Chia Lin ; Yi Chen Lin ; Mei Ying Hsiao ; Yau Shan Wu ; Chi Lin

  • Author_Institution
    Reliability Testing & Failure Anal. Dept., Powerchip Technol. Corp., Hsinchu, Taiwan
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    169
  • Lastpage
    172
  • Abstract
    Embedded memory is an integrated on-chip memory that supports the logic core to accomplish intended functions. High-performance embedded memory is a key component in VLSI, because of its high-speed and wide bus-width capability, which eliminates inter-chip communication. In this paper, embedded memory device and CMOS logic is integrated on-chip and it is a more complex of process technology compared with stand-alone memory. For the process engineering, we are always confronted with many problems, especially, the dislocation that causes some failures.
  • Keywords
    CMOS logic circuits; VLSI; dislocations; failure analysis; integrated memory circuits; CMOS logic; VLSI; dislocation issue; embedded memory device; embedded memory failure analysis; high-performance embedded memory; integrated on-chip memory; logic core; process technology; Current measurement; Failure analysis; Leakage currents; Microscopy; Rapid thermal annealing; System-on-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898135
  • Filename
    6898135