• DocumentCode
    2357897
  • Title

    Transient contact angle of evaporating inkjet droplet on trans-parent polymer substrate

  • Author

    Lok, Boon Keng ; Hu, Xiao

  • Author_Institution
    Singapore Inst. of Manuf. Technol., Singapore, Singapore
  • fYear
    2010
  • fDate
    8-10 Dec. 2010
  • Firstpage
    240
  • Lastpage
    245
  • Abstract
    For advanced control and optimization of inkjet-printed droplet and line morphologies, this paper seeks to provide insights into characterizing and understanding the transient behavior of the inkjet droplet on different surface conditions and substrate temperatures. The transient behavior of contact angle of tested fluids includes deionised water and glycerol solution is discussed. Fluids with different viscosity and surface tension are deposited by inkjet on polymer substrate in three surface conditions: as-received, plasma treated and hydrophobic coated. The substrates are subjected to various thermal exposures (from room temperature up to 75°C) during the printing process. The induced convective flux within the droplet is dependent on the initial interaction of the droplet and substrate. The impact of the surface temperature to the drying of the droplet is examined. “Stick-slip”, a phenomenon of the contact line of impinged droplet remain static for an interval of time and move abruptly toward the centre of the droplet, is observed on specific printing conditions and fluid properties. Video microscopy and digital image analysis techniques are applied to monitor and observe the evaporation of the droplets.
  • Keywords
    contact angle; drops; evaporation; heat treatment; ink jet printing; polymers; surface tension; viscosity; digital image analysis; droplet evaporation; hydrophobic coated surface; inkjet-printed droplet; line morphologies; optimization; plasma treated surface; surface temperature; surface tension; temperature 23 degC to 75 degC; transient contact angle; transparent polymer substrate; video microscopy; viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Packaging Technology Conference (EPTC), 2010 12th
  • Conference_Location
    Singapore
  • Print_ISBN
    978-1-4244-8560-4
  • Electronic_ISBN
    978-1-4244-8561-1
  • Type

    conf

  • DOI
    10.1109/EPTC.2010.5702640
  • Filename
    5702640