DocumentCode :
235790
Title :
Simple, novel and low cost numerical aperture increasing lens system for high resolution infrared image in backside failure analysis
Author :
Li Tian
Author_Institution :
Product Anal. Lab. of Quality Dept., Freescale Semicond. (China) Ltd., Tianjin, China
fYear :
2014
fDate :
June 30 2014-July 4 2014
Firstpage :
140
Lastpage :
145
Abstract :
As is known to all, we could capture clearer infrared (IR) image from backside as Si substrate was thinner. But if we needed higher resolution image with conventional optical objective lens, we must introduce numerical aperture increasing lens(NAIL) technology or shorter wavelength light to improve numerical aperture (NA) in objective space. Now some vendors can provide NanoLens with NAIL but it is very expensive. In this paper, we proposed one simple and novel system of NAIL. Firstly, we fabricated two NAILs (one R≈3mm, the other R≈ 5mm) with glass material, and captured higher resolution IR image with NAIL help. Secondly, we found clearer image from smaller size NAIL by comparing IR images. Then, we studied how to moving NAIL on backside surface of die. Two moving methods were designed and we discussed their advantage and disadvantage, one of them was used in FA experiment. Although there were some limitation and disadvantage for this system, we believed this simple, novel and low cost NAIL system was beneficial to our FA from backside.
Keywords :
failure analysis; image resolution; infrared imaging; lenses; backside failure analysis; high resolution infrared image; numerical aperture increasing lens technology; Decision support systems; Failure analysis; Integrated circuits; Fialure analysis; IR image; NAIL system; T-4-10 probe needle;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
ISSN :
1946-1542
Print_ISBN :
978-1-4799-3931-2
Type :
conf
DOI :
10.1109/IPFA.2014.6898136
Filename :
6898136
Link To Document :
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