DocumentCode :
2357963
Title :
A parametric study of dielectric spray cooling of a row of heaters in a narrow channel
Author :
Kearns, Don ; Du, Jian-Hua ; Chen, Ruey-Hung ; Chow, Louis C.
Author_Institution :
Sun Microsystems, Inc., Palo Alto, CA, USA
fYear :
2002
fDate :
12-14 March 2002
Firstpage :
164
Lastpage :
168
Abstract :
The cooling efficiency of dielectric liquid spray cooling in a narrow channel formed by two parallel simulated circuit boards was investigated as a function of fluid inlet temperature, supply pressure, heater temperature, power level, and channel length. The 400 mm channel was formed by a circuit board with a row of nine 38.1 mm square heat sources on one side, and a smooth acrylic plate 25 mm above. A single full cone atomizer (D0=0.33 mm) provided spray entering from one end which was directed parallel to and centered on the row of heaters. Reduction in fluid subcooling provided higher heat removal efficiency and uniform temperatures, at the expense of dryout on the final heater(s). Increases in liquid supply pressure improved heat removal efficiency at all heaters uniformly. The leading heater (centered at 23 mm downstream) was impinged more heavily and showed the highest heat removal efficiency (up to 14/spl times/10/sup -6/ W/m/sup 2/ K) and power handling of up to 60 W. Heater 9 (375 mm downstream) dissipated as much as 20 W, with heat transfer coefficients up to 2/spl times/10/sup -6/ W/m/sup 2/ K. Temperatures at all locations typically ranged from (35 to 70)/spl deg/C with as little as 2/spl deg/C variation from Heaters 1 to 8 (317 mm downstream).
Keywords :
printed circuit design; sprays; undercooling; 20 W; 35 to 70 degC; 400 mm; 60 W; channel length; cooling efficiency; dielectric spray cooling; dryout; fluid inlet temperature; fluid subcooling; full cone atomizer; heat removal efficiency; heat transfer coefficients; heater temperature; narrow channel; parallel simulated circuit boards; power handling; power level; supply pressure; Application specific integrated circuits; Circuit simulation; Circuit testing; Dielectric liquids; Electronics cooling; Heat transfer; Parametric study; Printed circuits; Spraying; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
Conference_Location :
San Jose, CA, USA
ISSN :
1065-2221
Print_ISBN :
0-7803-7327-8
Type :
conf
DOI :
10.1109/STHERM.2002.991363
Filename :
991363
Link To Document :
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