• DocumentCode
    2357963
  • Title

    A parametric study of dielectric spray cooling of a row of heaters in a narrow channel

  • Author

    Kearns, Don ; Du, Jian-Hua ; Chen, Ruey-Hung ; Chow, Louis C.

  • Author_Institution
    Sun Microsystems, Inc., Palo Alto, CA, USA
  • fYear
    2002
  • fDate
    12-14 March 2002
  • Firstpage
    164
  • Lastpage
    168
  • Abstract
    The cooling efficiency of dielectric liquid spray cooling in a narrow channel formed by two parallel simulated circuit boards was investigated as a function of fluid inlet temperature, supply pressure, heater temperature, power level, and channel length. The 400 mm channel was formed by a circuit board with a row of nine 38.1 mm square heat sources on one side, and a smooth acrylic plate 25 mm above. A single full cone atomizer (D0=0.33 mm) provided spray entering from one end which was directed parallel to and centered on the row of heaters. Reduction in fluid subcooling provided higher heat removal efficiency and uniform temperatures, at the expense of dryout on the final heater(s). Increases in liquid supply pressure improved heat removal efficiency at all heaters uniformly. The leading heater (centered at 23 mm downstream) was impinged more heavily and showed the highest heat removal efficiency (up to 14/spl times/10/sup -6/ W/m/sup 2/ K) and power handling of up to 60 W. Heater 9 (375 mm downstream) dissipated as much as 20 W, with heat transfer coefficients up to 2/spl times/10/sup -6/ W/m/sup 2/ K. Temperatures at all locations typically ranged from (35 to 70)/spl deg/C with as little as 2/spl deg/C variation from Heaters 1 to 8 (317 mm downstream).
  • Keywords
    printed circuit design; sprays; undercooling; 20 W; 35 to 70 degC; 400 mm; 60 W; channel length; cooling efficiency; dielectric spray cooling; dryout; fluid inlet temperature; fluid subcooling; full cone atomizer; heat removal efficiency; heat transfer coefficients; heater temperature; narrow channel; parallel simulated circuit boards; power handling; power level; supply pressure; Application specific integrated circuits; Circuit simulation; Circuit testing; Dielectric liquids; Electronics cooling; Heat transfer; Parametric study; Printed circuits; Spraying; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal Measurement and Management, 2002. Eighteenth Annual IEEE Symposium
  • Conference_Location
    San Jose, CA, USA
  • ISSN
    1065-2221
  • Print_ISBN
    0-7803-7327-8
  • Type

    conf

  • DOI
    10.1109/STHERM.2002.991363
  • Filename
    991363