Title :
Improvement of 3D current mapping by coupling magnetic microscopy and X-Ray computed tomography
Author :
Courjault, Nicolas ; Infante, Fulvia ; Bley, Vincent ; Lebey, T. ; Perdu, P.
Author_Institution :
Intraspec Technol., Toulouse, France
fDate :
June 30 2014-July 4 2014
Abstract :
Magnetic Microscopy has demonstrated all its functionality for 2D component thanks to its ability to image current density distribution from magnetic field. At the “More than Moore” age, we need to improve our capabilities to detect and localize failure in 3D components. Unfortunately, it is not possible to directly image 3D current density from a magnetic field scan. 3D conductive path information, that could come from design, and failure assumptions are also needed. In this paper, a new approach based on X-Ray Computed Tomography that bypasses the need of design information and failure site assumptions is presented and its results are discussed.
Keywords :
X-ray microscopy; computerised tomography; failure analysis; magnetic field measurement; 3D conductive path information; 3D current mapping; X ray computed tomography; coupling magnetic microscopy; image current density distribution; magnetic field; Failure analysis; Integrated circuits; Niobium;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898141