DocumentCode
235808
Title
Electromigration reliability of solder bumps
Author
Ceric, H. ; Selberherr, Siegfried
Author_Institution
Inst. for Microelectron., Tech. Univ. Wien, Vienna, Austria
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
336
Lastpage
339
Abstract
Characteristic of solder bumps is that during technology processing and usage their material composition changes. We present a model for describing a growth of intermetallic compound inside a solder bump under the influence of electro-migration. Simulation results based on our model are discussed in conjunction with corresponding experimental findings.
Keywords
alloys; electromigration; integrated circuit reliability; soldering; solders; electromigration reliability; intermetallic compound; solder bumps; Chemicals; Electromigration; Integrated circuit interconnections; Nickel; Reliability; Resistance; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898145
Filename
6898145
Link To Document