Title :
Super cooling structures for power electronics
Author :
Raj, Ewa ; Lisik, Z. ; Langer, Malgorzata ; Rudzki, Jacek
Author_Institution :
Inst. of Electron., Lodz Tech. Univ.
Abstract :
The paper presents the microchannel cooling structure. This very efficient heat sink is dedicated for power electronic applications characterised by high heat flux densities combined with high overall power levels. The conducted measurements show that to meet both thermal and mechanical demands; the structure can achieve thermal resistance of 0.1 K/W
Keywords :
heat sinks; power electronics; supercooling; thermal resistance; heat flux density; heat sink; mechanical demands; microchannel cooling structure; power electronic applications; super cooling structures; thermal demands; thermal resistance; Electronics cooling; Heat sinks; Heat transfer; Liquid cooling; Microchannel; Multichip modules; Power electronics; Thermal resistance; Trigeneration; Water heating; efficiency; thermal design;
Conference_Titel :
Power Electronics and Applications, 2005 European Conference on
Conference_Location :
Dresden
Print_ISBN :
90-75815-09-3
DOI :
10.1109/EPE.2005.219381
