Title :
Inverted scan transducer mount technique: A cost effective acoustic scanning of IGBT modules for failure analysis
Author :
De La Cruz, Em Julius ; De La Rea, Sheenel Karl ; McDonough, Suzanne ; Chai, S.F.
Author_Institution :
ON Semicond. Malaysia Sdn. Bhd., Seremban, Malaysia
fDate :
June 30 2014-July 4 2014
Abstract :
Acoustic Scanning for IGBT modules is a critical process to find anomalies that could lead to field failures. However, the cost to build this capability for failure analysis use is relatively expensive. This paper aims at evaluating a cost effective acoustic scanning technique for IGBT modules suitable for failure.
Keywords :
acoustic transducers; failure analysis; insulated gate bipolar transistors; IGBT modules; cost effective acoustic scanning; failure analysis; inverted scan transducer mount technique; Acoustics; Ceramics; Failure analysis; Insulated gate bipolar transistors; Thickness measurement; Transducers; Ultrasonic imaging;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898152
