• DocumentCode
    235825
  • Title

    ATR-FTIR, DUAL BEAM FIB-SEM, TEM and TOF-SIMS studies on high temperature and moisture induced “white haze” following the pattern of electrodes in touch panels

  • Author

    Chen Yixin ; Hao Meng ; Shao Jingjing ; Esther, Lee ; Khoo Bing Sheng ; Chooi Meailing ; Li Kai ; Xin Qiuju ; Cambridge, Kon ; Lee Hwang Sheng ; Shen Yiqiang ; Song Lu ; Xing Zhenxiang ; Zhou Yongkai ; Feng Yang ; Fu Chao ; Hua Younan ; Li Xiaomin

  • Author_Institution
    WinTech Nano-Technol. Services Pte. Ltd., Singapore, Singapore
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    131
  • Lastpage
    134
  • Abstract
    White haze or the so called mura effect has been recognized as a common defect in touch panels. Nevertheless, the underlying mechanism has not been fully understood and clearly investigated. In this study, a comprehensive characterization study using the ATR-FTIR, DUAL BEAM FIB-SEM, TEM and TOF-SIMS on the high temperature and moisture induced white haze, which follows the pattern of electrodes in touch panels, is first reported. It is suspected that the white haze is a moisture induced reflection alteration phenomenon of the OCA (optically clear adhesive), while the electrodes related pattern is highly dependent on the local variation in hygroscopic swelling.
  • Keywords
    Fourier transform spectra; adhesives; attenuated total reflection; electrodes; infrared spectra; scanning electron microscopy; secondary ion mass spectra; swelling; time of flight spectra; transmission electron microscopy; ATR-FTIR; DUAL BEAM FIB-SEM; OCA; TEM; TOF-SIMS; common defect; electrodes pattern; high temperature induced white haze; hygroscopic swelling; local variation; moisture induced white haze; mura effect; optically clear adhesive; reflection alteration phenomenon; touch panels; Decision support systems; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898153
  • Filename
    6898153