Title :
Detailed package failure analysis on short failures after high temperature storage
Author :
Oh, Z.Y. ; Foo, F.J. ; Qiu, Wei
Author_Institution :
Device Anal. Lab., Adv. Micro Devices (Singapore), Singapore, Singapore
fDate :
June 30 2014-July 4 2014
Abstract :
This paper describes the failure analysis approach in search of the root cause behind a series of short failures after high-temperature storage (HTS) test at 150°C. Findings revealed that UBM consumption by tin and the eventual disintegration allowed solder diffusion into the die circuitries resulting in the massive short failures.
Keywords :
failure analysis; flip-chip devices; integrated circuit reliability; high temperature storage; package failure analysis; short failures; solder diffusion; temperature 150 degC; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898174
