• DocumentCode
    235864
  • Title

    Detailed package failure analysis on short failures after high temperature storage

  • Author

    Oh, Z.Y. ; Foo, F.J. ; Qiu, Wei

  • Author_Institution
    Device Anal. Lab., Adv. Micro Devices (Singapore), Singapore, Singapore
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    278
  • Lastpage
    282
  • Abstract
    This paper describes the failure analysis approach in search of the root cause behind a series of short failures after high-temperature storage (HTS) test at 150°C. Findings revealed that UBM consumption by tin and the eventual disintegration allowed solder diffusion into the die circuitries resulting in the massive short failures.
  • Keywords
    failure analysis; flip-chip devices; integrated circuit reliability; high temperature storage; package failure analysis; short failures; solder diffusion; temperature 150 degC; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898174
  • Filename
    6898174
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235864