Title :
1991 Proceedings, Seventh Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.91CH2972-8)
Abstract :
The following topics are dealt with: analytical modeling; measurement techniques; thermal characterization; and analytical and computational modeling
Keywords :
integrated circuit technology; packaging; printed circuits; semiconductor technology; thermal analysis; thermal variables measurement; analytical modeling; analytical models; computational modeling; measurement techniques; printed circuits; semiconductor processing; thermal characterization; thermal management; thermal measurement;
Conference_Titel :
Semiconductor Thermal Measurement and Management Symposium, 1991. SEMI-THERM VII. Proceedings., Seventh Annual IEEE
Conference_Location :
Phoenix, AZ, USA
Print_ISBN :
0-87942-664-0
DOI :
10.1109/STHERM.1991.152931
