Thermal performance enhancement by exploitation of nano-effects

Thermal interface material resistance is one of the bottlenecks for efficient thermal management. Much research has been undertaken in the last years to overcome the finite thermal conductivity as well as the interface resistance of, above all, polymer-based TIMs varying material parameters such as filler particles material, size and modality as well as matrix material properties. Some improvement has been achieved, however, heat transport mechanisms on the continuum and nano scale, theoretical limits under technological and application-relevant boundary conditions need to be understood and used for the optimization of materials and processes. This paper addresses advancements in advanced thermal technology with respect to TIMs for die-attach and related characterization methods. Some of the work presented will be based on the results of the currently running EC-Project "Nanopack".