DocumentCode
2358776
Title
Enhancing fab performance under team council methodology
Author
Dupuis, Ronald N., Jr. ; Gervais, John ; Park, Steven
Author_Institution
Fairchild Semicond., South Portland, ME, USA
fYear
1998
fDate
23-25 Sep 1998
Firstpage
119
Lastpage
121
Abstract
The objective of this paper is to outline and describe the process of developing team councils in a wafer fab organization. Initially, we present the historical background and why we thought this type of approach was necessary to achieve high performance from all levels of the organization. A road map to success as well as a task level migration matrix describes the different levels of responsibility needed to achieve the results described in the conclusion of this paper. Though this process is still evolving and developing in the authors´ South Portland fab, the paper describes the necessary steps to implement this process
Keywords
computer integrated manufacturing; integrated circuit reliability; integrated circuit technology; integrated circuit yield; management; manufacturing resources planning; training; CIM; process implementation; responsibility levels; road map; task level migration matrix; team council methodology; team councils; training; wafer fab organization; wafer fab performance; Buildings; Computer integrated manufacturing; Councils; Data engineering; Management training; Manufacturing processes; Process control; Productivity; Semiconductor device manufacture; Time measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 1998. 1998 IEEE/SEMI
Conference_Location
Boston, MA
ISSN
1078-8743
Print_ISBN
0-7803-4380-8
Type
conf
DOI
10.1109/ASMC.1998.731424
Filename
731424
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