Title :
Advanced package circuit modification by μMilling
Author :
Hollerith, Christian ; Kruger, Bjorn ; Gezerci, Gurcan ; Pauthner, Siegfried ; Zimmermann, Gunnar
Author_Institution :
Infineon Technol. AG, Neubiberg, Germany
fDate :
June 30 2014-July 4 2014
Abstract :
As packages get smaller and more complex the necessity grows to do electrical modifications in packages to assist design process. Milling machines with accuracy of sub-μm enable a fast and effective approach to do such a kind of modification. In combination with other techniques, cutting of package connections as well as reconnecting of metal lines is possible.
Keywords :
electronics packaging; milling; milling machines; advanced package circuit modification; metal lines; milling machines; package connections; Decision support systems; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898189
