• DocumentCode
    235889
  • Title

    Advanced package circuit modification by μMilling

  • Author

    Hollerith, Christian ; Kruger, Bjorn ; Gezerci, Gurcan ; Pauthner, Siegfried ; Zimmermann, Gunnar

  • Author_Institution
    Infineon Technol. AG, Neubiberg, Germany
  • fYear
    2014
  • fDate
    June 30 2014-July 4 2014
  • Firstpage
    35
  • Lastpage
    38
  • Abstract
    As packages get smaller and more complex the necessity grows to do electrical modifications in packages to assist design process. Milling machines with accuracy of sub-μm enable a fast and effective approach to do such a kind of modification. In combination with other techniques, cutting of package connections as well as reconnecting of metal lines is possible.
  • Keywords
    electronics packaging; milling; milling machines; advanced package circuit modification; metal lines; milling machines; package connections; Decision support systems; Failure analysis; Integrated circuits;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
  • Conference_Location
    Marina Bay Sands
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-3931-2
  • Type

    conf

  • DOI
    10.1109/IPFA.2014.6898189
  • Filename
    6898189
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=235889