Short localization in a multi chip BGA package

Author

Gaudestad, J. ; Orozco, Alvaro ; Kimball, Mark ; Gopinadhan, Kalon ; Venkatesan, Thirumalai

Author_Institution

Neocera LLC, Beltsville, MD, USA

fYear

2014

fDate

June 30 2014-July 4 2014

Firstpage

74

Lastpage

77

Abstract

Magnetic Current Imaging (MCI) has been used for more than a decade to localize shorts and leakages in packages non-destructively. Now that packages are becoming more complex with multiple dies inside the same package, MCI is showing its effectiveness in localizing these complicated shorts non-destructively when the Failure Analysis (FA) engineer does not know from Automated Test Equipment (ATE) if the fault location is in the die or package or which die. We show in this paper that the FA lab can be simplified by the introduction of MCI as a one stop Fault Isolation (FI) tool for all shorts and leakages.

Keywords

automatic test equipment; ball grid arrays; multichip modules; packaging; ATE; MCI; automated test equipment; failure analysis engineer; fault isolation tool; fault location; magnetic current imaging; multi chip BGA package; short localization; Decision support systems; Failure analysis; Integrated circuits;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the

Conference_Location

Marina Bay Sands

ISSN

1946-1542

Print_ISBN

978-1-4799-3931-2

Type

conf

DOI

10.1109/IPFA.2014.6898191

Filename

6898191