Title :
An unique sample pretreatment method for circuit edit on WLCSP devices
Author :
Sheng-Yu Chen ; Chino Wang ; Puma Wu
Author_Institution :
Integrated Service Technol., Hsinchu, Taiwan
fDate :
June 30 2014-July 4 2014
Abstract :
In the present work, the thick organic passivation layer of WLCSP products was uniformly removed before the focused ion beam (FIB) circuit edit (CE) process. By this approach, the cycle time of the whole CE process can be remarkably decreased and the successful rate can be effectively increased. In addition, the suggested flows for successful CE under solder bumps and RDLs have been proposed.
Keywords :
chip scale packaging; focused ion beam technology; passivation; wafer level packaging; CE process cycle time; FIB CE process; RDL; WLCSP devices; WLCSP products; focused ion beam circuit edit process; organic passivation layer; sample pretreatment method; solder bumps; wafer-level chip-scale-package; Failure analysis; Integrated circuits;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898192
