DocumentCode
235897
Title
An unique sample pretreatment method for circuit edit on WLCSP devices
Author
Sheng-Yu Chen ; Chino Wang ; Puma Wu
Author_Institution
Integrated Service Technol., Hsinchu, Taiwan
fYear
2014
fDate
June 30 2014-July 4 2014
Firstpage
110
Lastpage
113
Abstract
In the present work, the thick organic passivation layer of WLCSP products was uniformly removed before the focused ion beam (FIB) circuit edit (CE) process. By this approach, the cycle time of the whole CE process can be remarkably decreased and the successful rate can be effectively increased. In addition, the suggested flows for successful CE under solder bumps and RDLs have been proposed.
Keywords
chip scale packaging; focused ion beam technology; passivation; wafer level packaging; CE process cycle time; FIB CE process; RDL; WLCSP devices; WLCSP products; focused ion beam circuit edit process; organic passivation layer; sample pretreatment method; solder bumps; wafer-level chip-scale-package; Failure analysis; Integrated circuits;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location
Marina Bay Sands
ISSN
1946-1542
Print_ISBN
978-1-4799-3931-2
Type
conf
DOI
10.1109/IPFA.2014.6898192
Filename
6898192
Link To Document