Title :
ICP-RIE Platinum (Pt) sputter etching
Author :
Mendaros, R.G. ; Marcelo, M.T.
Author_Institution :
Worldwide Product Anal., Analog Devices Gen. Trias (ADGT), Cavite, Philippines
fDate :
June 30 2014-July 4 2014
Abstract :
One of the coating materials that is used to reduced electron charging effect during Scanning Electron Microscope (SEM) imaging is Platinum (Pt). Removing Pt coating for parts requiring further electrical testing or deprocessing has been a challenge in failure analysis. This paper discusses the established methodology in removing Pt coating using the ICP-RIE sputter etching technique.
Keywords :
coatings; failure analysis; platinum; scanning electron microscopy; sputter etching; ICP-RIE platinum sputter etching technique; Pt; SEM imaging; coating material; coating removal; electrical testing; electron charging effect; failure analysis; inductive coupled plasma; scanning electron microscope imaging; Coatings; Etching; Materials; Scanning electron microscopy; Sputtering; Testing;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898195
