• DocumentCode
    2359053
  • Title

    A microcontinuum model of electrokinetic coupling in the extracellular matrix: perturbation formulation and solution

  • Author

    Chammas, P. ; Eisenberg, S.R.

  • Author_Institution
    Dept. of Biomed. Eng., Boston Univ., MA, USA
  • fYear
    1994
  • fDate
    1994
  • Firstpage
    748
  • Abstract
    A microcontinuum model is formulated to describe electrokinetic transduction interactions and transport in the extracellular matrix (ECM). A unit cell approach is used in which the ECM is modeled as an ordered array of charged solid cylinders surrounded by a diffuse double layer. The model includes the effects of overlapping diffuse double layers and the associated electrokinetic coupling within the bulk of the unit cell as exist under physiological conditions. A system of coupled differential equations is developed to describe the electrokinetic coupling within the unit cell. A perturbation expansion of the governing system is solved using the numerical grid generation technique and the electromechanical coupling coefficients for articular cartilage are determined
  • Keywords
    bioelectric phenomena; cellular biophysics; electrokinetic effects; physiological models; articular cartilage; charged solid cylinders; coupled differential equations system; diffuse double layer; electrokinetic coupling; electrokinetic transduction interactions; electromechanical coupling coefficients; extracellular matrix; microcontinuum model; numerical grid generation technique; ordered array; overlapping diffuse double layers; perturbation expansion; perturbation formulation; physiological conditions; unit cell approach; Biomedical engineering; Capacitive sensors; Electric potential; Electrochemical machining; Electrokinetics; Engine cylinders; Extracellular; Fluid flow; Phased arrays; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 1994. Engineering Advances: New Opportunities for Biomedical Engineers. Proceedings of the 16th Annual International Conference of the IEEE
  • Conference_Location
    Baltimore, MD
  • Print_ISBN
    0-7803-2050-6
  • Type

    conf

  • DOI
    10.1109/IEMBS.1994.415273
  • Filename
    415273