DocumentCode :
2359095
Title :
A new iterative algorithm for the solution for the load deflection square membranes
Author :
Youssef, H. ; Ferrand, A. ; Pons, P. ; Plana, R.
Author_Institution :
LAAS, CNRS, Toulouse, France
fYear :
2010
fDate :
26-28 April 2010
Firstpage :
1
Lastpage :
5
Abstract :
The reliability of micro electromechanical systems depends directly on the mechanical behavior of microstructures and their performances are strongly associated with a good knowledge of materials mechanical properties that compose them. Thus, it is important to precisely determine these properties. There are various methods for micro-materials´ characterization. In this work, we are interested in the bulge test technique in order to extract the mechanical properties of square shaped membranes. First, a FEM model has been realized with ABAQUS software. Then, an iterative algorithm has been developed and implemented in Matlab, it controls and optimizes the Finite Element simulation parameters. Secondly, a bulge test bench was set up to carry out experimental measurements. The iterative algorithm was then interfaced with the Abaqus software solver and used to fit the simulation results with the experimental measurements. The investigation reveals that the algorithm converges faster and gives good results. Besides, the proposed method allows us to find the mechanical properties of any membrane geometry and thickness.
Keywords :
finite element analysis; iterative methods; mechanical properties; membranes; micromechanical devices; reliability; ABAQUS software; FEM model; Matlab; bulge test technique; finite element simulation; iterative algorithm; load deflection square membranes; mechanical properties; membrane geometry; membrane thickness; microelectromechanical systems; microstructures; reliability; Biomembranes; Electromechanical systems; Finite element methods; Iterative algorithms; Materials reliability; Mathematical model; Mechanical factors; Microstructure; Software measurement; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on
Conference_Location :
Bordeaux
Print_ISBN :
978-1-4244-7026-6
Type :
conf
DOI :
10.1109/ESIME.2010.5464523
Filename :
5464523
Link To Document :
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