One die logic analysis through the backside

On Die Logic Analysis (ODLA) uses a scanning optical microscope (SOM) to quickly determine logic timing patterns, and then uses this information to identify logic pattern matches/mismatches on-the-fly from the backside. In this paper, the ODLA system and methodology will be described along with how, in one universal method, it can replace a slew of techniques such as Laser Timing Probe (LTP), Frequency Mapping (FM), and Phase Imaging (PI). It will be demonstrated on a chain of scan cells.