مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2359265

Title :

Joint plenary talks

fYear :

2009

fDate :

14-18 Sept. 2009

Keywords :

CMOS memory circuits; CMOS technology; Chip scale packaging; Electronics packaging; Integrated circuit reliability; Microelectronics; Nanoscale devices; Semiconductor device packaging; Semiconductor device reliability; Silicon;

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Solid State Device Research Conference, 2009. ESSDERC '09. Proceedings of the European

Conference_Location :

Athens, Greece

ISSN :

1930-8876

Print_ISBN :

978-1-4244-4351-2

Electronic_ISBN :

1930-8876

Type :

conf

DOI :

10.1109/ESSDERC.2009.5331385

Filename :

5331385

Link To Document :

https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2359265