Title :
Material characterization and failure analysis of through-silicon vias
Author :
Chenglin Wu ; Tengfei Jiang ; Im, Jay ; Liechti, Kenneth M. ; Rui Huang ; Ho, Paul S.
Author_Institution :
Dept. of Aerosp. Eng. & Eng. Mech., Univ. of Texas, Austin, TX, USA
fDate :
June 30 2014-July 4 2014
Abstract :
In this paper, the effects of Cu microstructure on the mechanical properties of TSV and via extrusion are studied using two types of through-silicon vias (TSVs) with different grain size distributions. A direct correlation is found between the Cu grain size and the mechanical properties of the TSVs. An analytical model is used to explore the relationship between the mechanical properties and via extrusion. The results show that small and uniform grains in the Cu vias led to smaller via extrusion. Such grain structures are effective for reducing via extrusion failure to improve TSV reliability.
Keywords :
copper; extrusion; failure analysis; grain size; integrated circuit reliability; three-dimensional integrated circuits; Cu; Cu grain size; Cu microstructure; Cu vias; TSV reliability; extrusion failure; failure analysis; grain size distributions; grain structures; material characterization; mechanical properties; through-silicon vias; Analytical models; Grain size; Plastics; Silicon; Thermal analysis; Thermal loading; Through-silicon vias;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
Print_ISBN :
978-1-4799-3931-2
DOI :
10.1109/IPFA.2014.6898206
