Vibration durability of Pb-free HVQFN assemblies

Author

Choi, C. ; Al-Bassyiouni, Moustafa ; Dasgupta, A. ; De Vries, J.W.C. ; Balemans, Will ; van Driel, W.

Author_Institution

Mech. Eng. Dept., Univ. of Maryland, College Park, MD, USA

fYear

2010

fDate

26-28 April 2010

Firstpage

1

Lastpage

6

Abstract

In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects and to extract model constants from test data.

Keywords

copper alloys; dynamic testing; electronics packaging; heat sinks; life testing; silver alloys; solders; tin alloys; HVQFN assemblies; SAC305 solder interconnects; SnAgCu; accelerated stress testing; heat-sink very-thin quad flat-pack no-leads; physics-of-failure simulation; vibration durability; vibration excitation; Assembly systems; Boundary conditions; Capacitive sensors; Data mining; Electric shock; Fatigue; Life estimation; Testing; Vehicles; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), 2010 11th International Conference on

Conference_Location

Bordeaux

Print_ISBN

978-1-4244-7026-6

Type

conf

DOI

10.1109/ESIME.2010.5464531

Filename

5464531