DocumentCode :
235932
Title :
Fusion prognostics-based qualification of microelectronic devices
Author :
Pecht, Michael ; George, Elviz ; Vasan, Arvind ; Chauhan, Prakash
Author_Institution :
Center for Adv. Life Cycle Eng. (CALCE), Univ. of Maryland, College Park, MD, USA
fYear :
2014
fDate :
June 30 2014-July 4 2014
Firstpage :
383
Lastpage :
389
Abstract :
The rapid evolution of electronic products has resulted in numerous choices for customers. This has made for intense competition between manufacturers to reduce costs and minimize the time to market for their products. One bottle-neck in getting products to market is the qualification process, which has traditionally been time-consuming and often inadequate to prevent failures in field. In particular, in the past decade, there have been significant numbers of microelectronic devices that have passed qualification tests but failed in the field. The resulting costs of these failures have been in the billions of dollars. Thus, there is a need to develop approaches to qualification methodologies that quicken the development time but also prevent product failures in the field. This paper discusses the current state of qualification practices in the electronics industry. Then, an alternative approach, called fusion prognostics, for qualification is presented that can make the process more efficient and cost-effective. This approach involves an in-situ qualification process that incorporates a fusion of machine learning techniques and physics-of-failure based prognostics. The machine learning techniques are used to monitor the degradation behavior during testing. On the other hand, the physics-of-failure techniques identify critical failure mechanisms and the acceleration factors.
Keywords :
electronic engineering computing; integrated circuit manufacture; integrated circuit reliability; integrated circuit testing; learning (artificial intelligence); production engineering computing; quality management; electronics industry; fusion prognostic; in-situ qualification process; machine learning technique; microelectronic device qualification; physics-of-failure based prognostics; product failure; qualification practice; qualification test; Decision support systems; Failure analysis; Integrated circuits;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium on the
Conference_Location :
Marina Bay Sands
ISSN :
1946-1542
Print_ISBN :
978-1-4799-3931-2
Type :
conf
DOI :
10.1109/IPFA.2014.6898209
Filename :
6898209
Link To Document :
بازگشت