Title :
Thermal design of converters using discrete power components incorporating an IGBT and a freewheeling diode
Author :
Van den Keybus, J. ; Nobels, T. ; Belmans, R.
Author_Institution :
Dept. of Electr. Eng., Katholieke Univ., Leuven, Heverlee
Abstract :
This paper presents an extension to the common engineering practice of adding a constant thermal resistance to the manufacturer supplied transient thermal impedance from the semiconductor to the package bottom (ZthetasJC) when mounting power components to a heat sink using electrically insulating pads. It is shown that, when those components contain more than one semiconductor, the proposed extension is necessary to avoid underestimation of the semiconductor junction temperatures, allowing an optimal use of the thermal capabilities of the semiconductors. A new, semi-intrusive measurement technique is used to validate this new design procedure with experimental data
Keywords :
heat sinks; insulated gate bipolar transistors; insulating materials; power bipolar transistors; power convertors; power field effect transistors; power semiconductor diodes; semiconductor junctions; thermal resistance; converter thermal design; discrete power components; freewheeling diode; heat sink; power component mounting; semi-intrusive measurement technique; semiconductor junction temperatures; semiconductor thermal capacity; thermal resistance; transient thermal impedance; Electric resistance; Impedance; Insulated gate bipolar transistors; Power engineering and energy; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device packaging; Semiconductor diodes; Thermal engineering; Thermal resistance; Thermal design; heat accumulation effect; inverter design; thermal impedance;
Conference_Titel :
Power Electronics and Applications, 2005 European Conference on
Conference_Location :
Dresden
Print_ISBN :
90-75815-09-3
DOI :
10.1109/EPE.2005.219459
